Graduate Intern
Intel - Phoenix AZ

Internship Category: Paid

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  • Job Description

    Intern will be a member of the Thermal & Fluids Lab within ATTD Core Competency. For this internship position, candidates will be working on the thermal characterization of innovative thermal solutions and novel thermal interface materials. The work includes multiple aspects in the definition and development of customized metrologies for the study of design, materials and process interactions within Intel’s packages. The intern is expected to develop solutions to problems using formal education and judgement. As part of the job function, intern will be expected to work in a team environment and interact with fellow engineers to define and implement lab experiments for the validation of concepts to support new package technology development.

    The ideal candidate should exhibit the following behavioral traits:

    • Hands-on, self-motivated, proficient in technical problem solving, and a team player.

    Qualifications

    You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

    Minimum Qualifications:
    Be pursuing a MS in Mechanical Engineering.
    Have a strong background in heat transfer and fluid dynamics.
    Be able to demonstrate the ability to successfully apply the fundamentals of heat transfer / fluid dynamics to the characterization of the IC/package and enabling solutions.
    Experimental background with hands-on experience is required along with familiarity with commercial software, LabVIEW / MATLAB.

    Preferred Qualifications:
    Familiarity with CAD software such as Solidworks is preferred.
    Thermo-mechanical understanding including optical diagnostics and off-the-shelf thermal / mechanical testing equipment is a plus.

    Inside this Business Group

    As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

    Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

    Job Description

    Intern will be a member of the Thermal & Fluids Lab within ATTD Core Competency. For this internship position, candidates will be working on the thermal characterization of innovative thermal solutions and novel thermal interface materials. The work includes multiple aspects in the definition and development of customized metrologies for the study of design, materials and process interactions within Intel’s packages. The intern is expected to develop solutions to problems using formal education and judgement. As part of the job function, intern will be expected to work in a team environment and interact with fellow engineers to define and implement lab experiments for the validation of concepts to support new package technology development.

    The ideal candidate should exhibit the following behavioral traits:

    • Hands-on, self-motivated, proficient in technical problem solving, and a team player.

    Qualifications

    You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

    Minimum Qualifications:
    Be pursuing a MS in Mechanical Engineering.
    Have a strong background in heat transfer and fluid dynamics.
    Be able to demonstrate the ability to successfully apply the fundamentals of heat transfer / fluid dynamics to the characterization of the IC/package and enabling solutions.
    Experimental background with hands-on experience is required along with familiarity with commercial software, LabVIEW / MATLAB.

    Preferred Qualifications:
    Familiarity with CAD software such as Solidworks is preferred.
    Thermo-mechanical understanding including optical diagnostics and off-the-shelf thermal / mechanical testing equipment is a plus.

    Inside this Business Group

    As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth

    Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

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